Tektronix ST501 Surface Mount Device Interconnects

Surface Mount Device Probing and Interconnects The increasing use of surface mount technology (SMT) brings many benefits to electronic circuit board (ECB) design and manufacture. Among these are increased circuit density, increased product reliability and lower assembly costs. Troubleshooting and device interconnection, however, have become more difficult due to decreased device size, tighter lead spacing and increased ECB densities. Tektronix' offering of the following SMT probing and interconnect devices meets these demanding requirements. SureFoot Adapter Probing 25 mil JEDEC, 0.65 and 0.5 mm EIAJ Packages The SureFoot adapter is an integral probe tip and miniature guide that enables fault-free "hands-on" probing of fine-pitch SMD packages. Guided by the IC's leads, the SureFoot adapter's miniature plastic tines align the probe before electrical contact is made. The tines also form a shield between IC leads, preventing the probe tip from shorting adjacent pins. The SureFoot adapter conforms to EIAJ (Electronic Industry Association of Japan) or JEDEC (Joint Electron Device Engineering Council) packaging standards, assuring quick and reliable probe contact with fine-pitch IC leads. Several color coded versions of the SureFoot adapter are available, addressing the most common SMD packages. The yellow version fits the 50 mil (JEDEC) center packages. The blue version fits both the 25 mil (JEDEC) and the .65 mm (EIAJ) center packages. Finally, the red versions fit the tighter, 0.5 mm (EIAJ) center packages. ST501 SureToe™ Adapter For 0.010 in. spacing Insulated SureToe Adapter protects adjacent legs. Allowing signal acquisition of its neighbor.

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